Focusing on the R&D and production of compound semiconductor

— APSEMI®—

Providing high-efficiency and cost-effective semiconductor chip products and solutions for industrial Internet of Things, intelligent terminals, smart cities, new energy, automotive electronics and other Internet of Things applications

Material R&D Team

Compound Semiconductors

Chip Design Team

Hall Sensors
Optocouplers
Power Semiconductors

Semicon Packaging

TO247-2/3/4 SOP4/8/16 SMD4/6/8 DIP4/6/8
SOT-227 SOT23 TO92 DFN SIP ZIP

Reliability Test

ISO9001 and IATF16949

— PRODUCT FEATURES

PHOTO DMOSRELAY

-High Reliability: Stable on-resistance impedance

-High Insulation: The isolation voltage can exceed 5KV.

-Long Lifetime: No mechanical contacts, no switching wear.

-High Operation Speed: Working/release time is about 0.3ms.

-Other Advantages: Small size, low power consumption, low leakage current, bounce-free and noiseless.

(GaAs/InSb) HALL ELEMENT

Gallium arsenide (GaAs) Hall elements: offer a number of key advantages, including high sensitivity, low temperature drift, zero hysteresis, a magnetic field linear operating range up to 2T and other excellent characteristics. 

Indium antimonide (InSb) Hall elements: offer ultra-high sensitivity, but their temperature characteristics are less favourable compared to GaAs Hall elements. Therefore, a constant voltage drive is typically used to ensure more stable temperature characteristics, making them suitable for DC brushless motors and closed-loop current sensors.

OPTOCOUPLER

-Excellent Electrical Isolation Performance: Complete electrical isolation between input/output terminals.

-Signal Unidirectional Transmission: Effectively block the connection between the circuit and the system to complete the signal transmission.

-Strong Anti-interference Ability: Ensure that the signal is not subject to electromagnetic interference in the transmission process.

-Fast Response Speed: Millisecond response speed, reduces signal attenuation.

-Simple Circuit Design: Easier to match various logic circuits.

— PRODUCT FEATURES

Vertically integrated model (IDM)

From chip design to manufacturing

R&D of compound semiconductor materials and chips

(Sic Power Semiconductor,GaAs and InSb Hall Elements)

Customized chip design services

ADDRESS:

17F, North Industrial Building, No. 3003 Shennan Road, Futian District, Shenzhen, China

TEL:

+86-755-83-666-556
+86-755-83-666-557
+86-755-83-666-558

E-mail:

apsemi@a-semi.com
sales@a-semi.com
design@a-semi.com

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